Kungekudala, bekukho impumelelo esemgangathweni kwinkqubo yokusika i-cathode eyayibethelele ishishini ixesha elide.
Ukupakisha kunye neenkqubo zokuvala:
Kwiminyaka yakutshanje, njengoko imarike yamandla entsha iye yashushu, umthamo ofakiweyo weiibhetri zamandlaiye yanda unyaka nonyaka, kwaye ingcamango yabo yoyilo kunye neteknoloji yokucubungula iye yaphuculwa ngokuqhubekayo, phakathi kwayo ingxoxo malunga nenkqubo yokucima kunye nenkqubo yokulambisa iiseli zombane ayizange iyeke. Okwangoku, eyona nto iphambili kwintengiso yeyona nto isebenzayo, ixabiso eliphantsi kunye nokusetyenziswa okuvuthiweyo kwenkqubo yokujika, kodwa le nkqubo inzima ukulawula ukwahlukaniswa kwe-thermal phakathi kweeseli, ezinokuthi zikhokelele ngokulula kubushushu basekhaya beeseli kunye umngcipheko wokusasazeka kwe-thermal.
Ngokwahlukileyo, inkqubo ye-lamination inokudlala ngcono iinzuzo ezinkuluiiseli zebhetri, ukhuseleko lwayo, ubuninzi bamandla, ulawulo lwenkqubo lunenzuzo ngakumbi kunomoya. Ukongeza, inkqubo lamination unako ukulawula ngcono isivuno iseli, kumsebenzisi woluhlu isithuthi amandla amatsha liya lisanda umkhwa ophezulu, inkqubo lamination iingenelo ingxinano ephezulu amandla ethembisa ngakumbi. Okwangoku, intloko yabavelisi bebhetri yamandla kuphando kunye nokuveliswa kwenkqubo ye-laminated sheet.
Kubantu abanokuba ngabanini bezithuthi zamandla amatsha, ixhala le-mileage ngokungathandabuzekiyo yenye yezinto eziphambili eziphembelela ukhetho lwabo lwesithuthi.Ngokukodwa kwizixeko apho izibonelelo zokutshaja zingafezekanga, kukho imfuneko engxamisekileyo yoluhlu olude lwezithuthi zombane. Okwangoku, uluhlu olusemthethweni lwezithuthi ezitsha zombane ezicocekileyo zibhengezwa ngokubanzi kwi-300-500km, kunye noluhlu lwangempela luhlala luncitshiswa ukusuka kuluhlu olusemthethweni ngokuxhomekeke kwimozulu kunye neemeko zendlela. Ikhono lokunyusa uluhlu lwangempela luhambelana ngokusondeleyo noxinano lwamandla kwiseli yamandla, kwaye inkqubo ye-lamination ke ngoko ikhuphisana ngakumbi.
Nangona kunjalo, ukuntsonkotha kwenkqubo yokulambisa kunye nobunzima obuninzi bobugcisa obufuna ukusonjululwa buthintele ukuthandwa kwale nkqubo kwinqanaba elithile. Olunye ubunzima obuphambili kukuba i-burrs kunye nothuli oluveliswa ngexesha lokusikwa kunye nenkqubo ye-laminating ngokulula kunokubangela iisekethe ezimfutshane kwibhetri, nto leyo yingozi enkulu yokhuseleko. Ukongeza, izinto ze-cathode ziyinxalenye yexabiso elibi kakhulu kwiseli (i-LiFePO4 i-cathodes i-akhawunti ye-40% -50% yeendleko zeseli, kunye ne-ternary lithium cathodes i-akhawunti yeendleko eziphezulu kakhulu), ngoko ke ukuba i-cathode esebenzayo kwaye ezinzileyo. indlela yokucubungula ayifumaneki, iya kubangela inkcitho enkulu yeendleko kubenzi bebhetri kwaye inciphise uphuhliso olongezelelweyo lwenkqubo yokulahla.
Hardware die-cutting status quo - izinto ezisetyenziswayo eziphezulu kunye nesilingi ephantsi
Okwangoku, kwinkqubo die-ukusika phambi inkqubo laminating, kuyinto eqhelekileyo kwimarike ukusebenzisa hardware die punching ukusika iqhekeza pole usebenzisa umsantsa encinane kakhulu phakathi punch kunye kufa isixhobo esezantsi. Le nkqubo yomatshini inembali ende yophuhliso kwaye ikhulile ngokufanelekileyo kwisicelo sayo, kodwa iingcinezelo eziziswa ngokuluma ngomatshini zihlala zishiya izinto ezicutshungulwayo kunye neempawu ezingathandekiyo, ezifana neekona ezidilikileyo kunye ne-burrs.
Ukuze uthintele i-burrs, i-hardware die punching kufuneka ifumane olona xinzelelo lwecala olufanelekileyo kunye nesixhobo sokugqithela ngokobume kunye nobukhulu be-electrode, kwaye emva kwemijikelo emininzi yovavanyo ngaphambi kokuqala ukusetyenzwa kwebhetshi. Ngaphezu koko, i-hardware die punching inokubangela ukunxitywa kwesixhobo kunye nezinto ezincamathelayo emva kweeyure ezinde zomsebenzi, ezikhokelela ekungazinzini kwenkqubo, okukhokelela kumgangatho ombi wokunqunyulwa, onokuthi ekugqibeleni ukhokelele kwimveliso ephantsi yebhetri kunye neengozi zokhuseleko. Abavelisi bebhetri bamandla bahlala betshintsha iimela rhoqo ngeentsuku ezi-3-5 ukuphepha iingxaki ezifihliweyo. Nangona ubomi besixhobo esibhengezwe ngumenzi bunokuba ziintsuku ezi-7-10, okanye banokusika amaqhekeza ezigidi ezi-1, kodwa umzi-mveliso webhetri ukunqanda iibhetshi zeemveliso ezineziphene (isidingo esibi kufuneka sichithwe kwiibhetshi), ngokufuthi siya kutshintsha imela kwangaphambili, kwaye oku kuya kuzisa iindleko ezinkulu zokuthenga.
Ukongeza, njengoko kukhankanyiwe ngasentla, ukuze kuphuculwe uluhlu lwezithuthi, iifektri zebhetri ziye zasebenza nzima ukuphucula ubuninzi bamandla ebhetri. Ngokutsho kwemithombo yoshishino, ukuze kuphuculwe ukuxinana kwamandla kwiseli enye, phantsi kwenkqubo ekhoyo yeekhemikhali, imichiza ithetha ukuphucula ingxinano yamandla kwiseli enye ngokusisiseko ichukumise isilingi, kuphela ngoxinaniso lokuxinana kunye nobukhulu becala. Isibonda sokwenza izinto ezimbini. Ukunyuka koxinzelelo lokuxinana kunye nobukhulu beepali ngokuqinisekileyo kuya kulimaza isixhobo ngakumbi, oku kuthetha ukuba ixesha lokutshintsha isixhobo liya kufinyezwa kwakhona.
Njengoko ubungakanani beseli bukhula, izixhobo ezisetyenziselwa ukwenza ukusika ukufa kufuneka zenziwe zibe nkulu, kodwa izixhobo ezinkulu ngokungathandabuzekiyo ziya kunciphisa isantya sokusebenza ngoomatshini kunye nokunciphisa ukusebenza kakuhle. Kunokuthiwa izinto ezintathu eziphambili zomgangatho ozinzileyo wexesha elide, umgangatho ophezulu woxinaniso lwamandla, kunye nobungakanani obukhulu bokusika isibonda simisela umda ophezulu wenkqubo yokusika i-hardware, kwaye le nkqubo yemveli iya kuba nzima ukuyiqhelanisa nekamva. uphuhliso.
Izisombululo ze-laser zePicosecond ukoyisa imiceli mngeni elungileyo yokubulala
Uphuhliso olukhawulezayo lweteknoloji ye-laser lubonise amandla alo ekuqhutyweni kwemizi-mveliso, kwaye imboni ye-3C ngokukodwa ibonise ngokupheleleyo ukuthembeka kwee-lasers ekuqhutyweni ngokuchanekileyo. Nangona kunjalo, iinzame zangaphambili zenziwa ukusebenzisa i-nanosecond lasers ukusika isibonda, kodwa le nkqubo ayizange ikhuthazwe kwizinga elikhulu ngenxa yendawo enkulu echatshazelwe ngubushushu kunye ne-burrs emva kwe-nanosecond laser processing, engazange ihlangabezane neemfuno zabenzi beebhetri. Nangona kunjalo, ngokutsho kophando lombhali, isisombululo esitsha sicetywe ziinkampani kwaye iziphumo ezithile zifunyenwe.
Ngokomgaqo wobugcisa, i-picosecond laser iyakwazi ukuthembela kumandla ayo aphezulu kakhulu ukuze ikhuphe umphunga ngoko nangoko ngenxa yobubanzi bayo obumxinwa kakhulu. Ngokungafaniyo nokusetyenzwa kwe-thermal kunye ne-nanosecond lasers, iilaser zepicosecond kukukhupha umphunga okanye iinkqubo zohlaziyo ezineziphumo ezincinci zobushushu, akukho ntsimbi zinyibilikayo kunye nemiphetho ecocekileyo yokusetyenzwa, eyaphula umgibe weendawo ezinkulu ezichaphazeleke bubushushu kunye ne-burrs nge-nanosecond lasers.
Inkqubo ye-picosecond laser die-cutting process iye yasombulula amaninzi amanqaku eentlungu ze-hardware yangoku, evumela ukuphuculwa kwekhwalithi kwinkqubo yokusika i-electrode efanelekileyo, ejongene neyona nxalenye inkulu yeendleko zeseli yebhetri.
1. Umgangatho kunye nesivuno
I-Hardware die-cutting kukusetyenziswa komgaqo wokubethelwa koomatshini, iikona zokusika zithande ukuba neziphene kwaye zifuna ukulungiswa ngokuphindaphindiweyo. Abasiki bematshini baya kuguga ngokuhamba kwexesha, nto leyo ekhokelela ekubeni kubekho i-burrs kwiingceba zeepali, ezichaphazela isivuno sebhetshi yonke yeeseli. Kwangaxeshanye, ukonyuka koxinzelelo lokuxinana kunye nobukhulu beqhekeza lepali ukuphucula ukuxinana kwamandla e-monomer kuya kwandisa ukuguga kunye nokukrazula kwemela yokusika.I-300W yamandla aphezulu e-picosecond laser processing inomgangatho ozinzile kwaye inokusebenza ngokuthe ngcembe. ixesha elide, nokuba impahla ijiyile ngaphandle kokubangela ukulahleka kwezixhobo.
2. Ukusebenza kakuhle ngokubanzi
Ngokubhekiselele ekusebenzeni kwemveliso ngokuthe ngqo, i-300W ephezulu yamandla epicosecond laser positive electrode umatshini wokuvelisa ukwinqanaba elifanayo lemveliso ngeyure njengomatshini wokuvelisa we-hardware wokusika, kodwa ngokuqwalasela ukuba oomatshini behardware kufuneka batshintshe iimela kanye ngeentsuku ezintathu ukuya kwezintlanu. , okuya kuthi ngokuqinisekileyo kubangele ukuvalwa komgca wemveliso kunye nokuphinda kugunyaziswe emva kokutshintshwa kwemela, utshintsho ngalunye lwemela luthetha iiyure eziliqela zokuphumla. Imveliso ye-laser ephezulu yesantya igcina ixesha lokutshintsha isixhobo kwaye ukusebenza kakuhle kukonke kungcono.
3. Ukuba bhetyebhetye
Kwiifektri zeeseli zamandla, umgca wokulambisa uya kuhlala uphethe iindidi zeeseli ezahlukeneyo. Utshintsho ngalunye luyakuthatha iintsuku ezimbalwa kwisixhobo sokusika ii-hardware, kwaye ngenxa yokuba ezinye iiseli zineemfuno zokubethelwa kwekona, oku kuya kwandisa ixesha lokutshintsha.
Inkqubo ye-laser, kwelinye icala, ayinayo ingxaki yokutshintsha. Nokuba lutshintsho lwemilo okanye utshintsho lobungakanani, i-laser inokwenza "konke". Kufuneka kongezwe ukuba kwinkqubo yokusika, ukuba imveliso ye-590 ithathelwe indawo yi-960 okanye imveliso ye-1200, i-hardware yokusika i-hardware idinga imela enkulu, ngelixa inkqubo ye-laser idinga kuphela i-1-2 iinkqubo ezongezelelweyo ze-optical kunye nokusika. ukusebenza kakuhle akuchaphazeleki. Kunokuthiwa, nokuba lutshintsho lwemveliso yobuninzi, okanye iisampulu zovavanyo oluncinci, ukuguquguquka kweenzuzo ze-laser ziye zaphula umda ophezulu we-hardware yokusika ukufa, kubavelisi bebhetri ukugcina ixesha elininzi. .
4. Iindleko eziphantsi zizonke
Nangona inkqubo yokusika i-hardware ye-hardware okwangoku iyinkqubo eqhelekileyo yokuqhawula izibonda kunye neendleko zokuqala zokuthenga ziphantsi, zifuna ukulungiswa rhoqo kweefa kunye neenguqu ezifayo, kwaye ezi zenzo zokulondoloza zikhokelela ekunciphiseni umgca wemveliso kwaye zibiza iiyure ezininzi zabantu. Ngokwahlukileyo, isisombululo se-laser picosecond asinazo ezinye izinto ezisetyenziswayo kunye neendleko ezincinci zokulandela ukugcinwa.
Ekuhambeni kwexesha, isisombululo se-laser picosecond kulindeleke ukuba sitshintshe ngokupheleleyo inkqubo yangoku yokusika i-hardware ekhoyo kwi-lithium yebhetri ecocekileyo yokusika i-electrode, kwaye ibe yenye yeengongoma eziphambili zokukhuthaza ukuthandwa kwenkqubo yokulayita, njenge " inyathelo elinye elincinci le-electrode die-cutting, elinye inyathelo elikhulu lenkqubo yokulambisa". Ewe kunjalo, imveliso entsha ixhomekeke kuqinisekiso lwemizi-mveliso, nokuba isisombululo se-picosecond laser esilungileyo sokusika ukufa sinokuqondwa ngabavelisi abakhulu bebhetri, kwaye ingaba i-picosecond laser inokusombulula ngokwenene iingxaki eziziswe kubasebenzisi ngenkqubo yemveli, masilinde sibone.
Ixesha lokuposa: Sep-14-2022